Dallas TX, USA –?? TI’s new TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1 ??C.
The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces.
In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus.
Up to eight TMP103s can be tied together in parallel and easily read by the host.
The TMP103 is especially ideal for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored.
Texas Instruments develops analog, digital signal processing, RF and DLP?? semiconductor technologies that help customers deliver consumer and industrial electronics products with greater performance, increased power efficiency, higher precision, more mobility and better quality.
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