Infineon First to Market With Temperature Sensor in Memory Modules Supporting Intel’s Thermal Management Features in Mobile Platforms
SAN JOSE, CA — (MARKET WIRE) — Infineon Technologies AG (FSE: IFX) (NYSE: IFX), a leading supplier of memory products, announced that it has developed a computer memory module with an integrated thermal sensor that uses real-time temperature data to optimize mobile system performance. Available now in sample quantities, the new TS-on-DIMM (Thermal Sensor on Dual In-line Memory Module) is the industry’s first such module for use with forthcoming mobile platforms from Intel.
Infineon demonstrated TS-on-DIMM products using a prototype Intel platform at the Spring Intel Developer Forum last week(Podcasts of the keynote speeches are still online as of 3-13-06).
Intel supports TS on DIMM technology as a smart feature for managing system performance based on the actual thermal performance of system components. This technology reduces the operating speed of a system when temperature on a DIMM reaches a pre-set level. This throttling decreases power consumption while delivering the best possible performance to the end-user.
Infineon DRAM chips, which are based on trench architecture technology, have been shown in tests of comparable-density DIMMs to run about 20 percent cooler than devices based on stack DRAM architecture. (Trench and stack are the two common architectures used to make DRAM chips.)
The temperature sensor on the SO-DIMM combined with the improved thermal performance of the Infineon DRAM minimizes the potential for throttling down, keeping the system at maximum bandwidth. In tests performed in 2005, the improved thermal profile of Infineon’s chips contributed to a 30 percent improvement in sustained memory bandwidth using Intel’s DT (Delta Temperature) in SPD technology, which is similar to the more advanced technology supported by the new TS-on-DIMM products. Infineon expects similar or improved results can be achieved using TS-on-DIMM.
“Memory power is becoming increasingly important to overall system performance; TS on DIMM is a significant step toward achieving close-loop memory thermal management while optimizing platform performance,” said Keith Kressin, Director of Marketing, Mobility Group, Intel Corporation. “The availability of technologies like TS on DIMM from memory suppliers enables system designers to provide optimized performance and reliability to mobile platform end-users.”
“Infineon is listening to its customers and end-users to anticipate performance requirements and deliver solutions in time to meet the needs of specific market segments,” said Bernd Lienhardt, Vice President, Memory Products for Infineon Technologies. “Mobile computing continues to be a strong growth segment for both standard DRAM and specialized components, and Infineon has demonstrated successfully that we can meet the specialized requirements of our customers for this important market.”
Initially available as a 1 GB, 667 MHz DDR2 SO-DIMM, Infineon TS-on-DIMM products are sampling now to select system customers, with pricing for small sample quantities set at US $150. Infineon anticipates releasing future devices, including 2 GB density TS-on-DIMM, later this year. For further pricing information or product samples please contact Infineon Technologies directly.
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2005 (ending September), the company achieved sales of Euro 6.76 billion with about 36,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.