Newswise ??? Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer.
The modified material can reliably operate at temperatures of up to 200 ??C.
The new thermal interface material could be used to draw heat away from electronic devices in servers, automobiles, high-brightness LEDs and certain mobile devices.
The material is fabricated on heat sinks and heat spreaders and adheres well to devices, potentially avoiding the reliability challenges caused by differential expansion in other thermally-conducting materials.
???Thermal management schemes can get more complicated as devices get smaller,??? said Baratunde Cola, an assistant professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology.
???A material like this, which could also offer higher reliability, could be attractive for addressing thermal management issues. This material could ultimately allow us to design electronic systems in different ways.???
Read the rest online at: www.newswise.com/articles/view/615722/?sc=swhr&xy=10004961.
Released: 3/27/2014 1:00 PM EDT
Source Newsroom: Georgia Institute of Technology