3rd Gen MicroCAM Infrared Thermal Imaging Core

At SPIE.DSS EXPO from Thermoteknix

MicroCAM 3  ultra-low-power-core

MicroCAM 3 ultra-low-power-core

Baltimore MD, USA — British company Thermoteknix Systems Ltd launched MicroCAM 3 at SPIE DSS 2015 in Baltimore this week.

This new module has higher performance, a faster frame rate, lower power, in a smaller package.

Weighing just 30 g, MicroCAM 3 draws <0.55 W of power and is available in both 384×288 17 µ and 640×480 17 µ formats.

MicroCAM 3 features Thermoteknix patented shutterless XTi Technology® so viewing is never interrupted.

This also does away with moving parts making MicroCAM 3 ultra-reliable, silent and super power-efficient.

MicroCAM 3

MicroCAM 3 Low Power Thermal Imaging Core w/lens

In a cylindrical package, the module is ready to integrate into third party OEM technology – from aerospace/defence, police and security/border patrol, search & rescue to hunting, wildlife monitoring, scientific and R&D devices.

The option of a fully waterproofed, sealed housed MicroCAM 3 with a variety of pre-integrated lenses is also available for users looking for a complete solution.

More details online at: http://www.thermoteknix.com/products/oem-thermal-imaging/microcam-3-low-power-thermal-imaging-cores/

About Thermoteknix

Thermoteknix Systems Ltd is one of the world’s leading innovators and manufacturers of thermal imaging systems. Thermoteknix MIRICLE® & MicroCAMTM based products are not subject to US ITAR control but may require UK export licence depending on the end-user country and specification.

Thermoteknix Systems Ltd
Teknix House, 2 Pembroke Avenue
Waterbeach, Cambridge CB25 9QR
United Kingdom

Tel: +44 (0)1223 204000
Fax: +44 (0)1223 204010
Email: enquiries@thermoteknix.com
Website: www.thermoteknix.com

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