Advancements in Thermal Management 2010

Education for Your Thermal Mitigation Electronics Designs – October 19th, 2010 in Dallas, Texas

Greenwood Village CO, USA — Advancements in Thermal Management 2010 is the must attend event for any design engineer, system engineer and R&D manager wanting to learn about the latest advancements in thermal management and mitigation. Learn from industry experts, tour the highly focused exhibit hall and networking with industry colleagues in a relaxed and educational environment.

If you are looking to learn more about managing thermal related issues in your power electronics design, this is your must attend event of the year.

Register Today!

Sessions Include:

Upcoming and Emerging Technologies for Thermal Management
It is becoming increasingly important to not only remove heat from a volume of air, but to do so at reduced noise levels, smaller form factors, lower costs and with minimal power consumption. Creative solutions will be required to achieve these goals.

Recent research suggests thermosyphon-based heat exchangers are a potential solution. A comparison of thermosyphon-based heat exchangers versus traditional cooling solutions will be presented. The primary focus will be comparing the thermosyphon solution with conventional air-air heat exchangers.

Attendees will learn the advantages and disadvantages of using a thermosyphon, as well as the feasibility of thermosyphons vs. traditional cooling methods.
Nathan Muoio, Mechanical Engineer, Purcell Systems

Thermal Management by Alumina ??? A ‘New’ Old Material
A brief technology review is given for the use of alumina as a versatile substrate solution in many cases, especially where power management and semiconductor junction temperatures are a critical issue.

Basic layout criteria are reviewed for practical application and decisions on whether or not to use alumina, and the latest technological developments are included, such as flip chip resistor networks and multilayer substrates on alumina for complex circuitry realization.
Dr. Wolfgang Tschanun, Head Micro Systems Technologies activities, Reinhardt Microtech

Advancements in Air Moving Technology for Active Cooling of Electronics in Lighting, Telecom, Embedded, Computing and Medical Applications
Engineers, designers and project managers are under constant pressure to develop electronics, computer, and LED products that are faster, brighter, more powerful and more complex, all in innovative and often smaller enclosures and applications. They are pushing their designs to the limits of today’s technology for active thermal management.

This session will discuss a revolutionary technology for active thermal management with quiet, reliable highly adaptable fanless air moving devices that dissipate heat in computer, telecom, medical or LED lighting products efficiently, effectively and directly in a highly flexible form factor using low power.
Brandon Noska, Applications Engineering Manager, Nuventix

Advancements in Thermal Management at PCB Board Level for Electronics Design and Fabrication
LED lighting provides both promise and challenges for virtually every electric lighting application currently served by earlier illumination technologies.

However, the major drawback for LED lighting, in concentrated arrays or in high-power applications, is the dissipation of heat. This heat must be conducted away from the die to the underlying circuit board and heat sinks. LED system manufacturers are addressing this challenge by seeking out improved heat sink designs, high efficiency circuit boards, high thermal conductivity enclosures and other thermal design techniques.
Pratish Patel, President and CEO, Electronic Interconnect

Advanced Nano-particle Coolant for Electronics and Battery Cooling
Nano-particle based coolants can advance thermal management of both electronics and battery cooling systems.??These fluids offer the best properties of both dielectric fluids, such as a hydrocarbon liquid, and water-based fluids, such as glycols.

The nano-particles in the coolant act as a deionizing agent, which keeps the conductivity low as in a dielectric fluid.?? Since the coolant is water-based, it has better thermal properties, similar to a glycol. This presentation consists of an explanation of how nano-particle coolants work and a comparison of electrical conductivity and thermal properties of similar coolants.
D. Patrick McMullen, Business Development Manager, Dynalene, Inc.

Thermal Efficiency Study of Heat Shield Materials
The demand for high performance heat shields is increasing broadly. An experimental investigation was carried out by a leading manufacturer of industrial engines to study the relative heat-shielding capability of aluminum, steel and composite materials to provide a high-performance heat shield.

Because of new technology to improve engine performance, and to meet stringent emission requirements, heat shields have become the basic component to manage higher temperatures in automotive applications.

This presentation will examine this study and will include an overview on heat shields, advances in heat shield materials; finite element and modal analysis details; and analytical thermal analysis findings. While the study was conducted for automotive applications, its findings in experimental set-up, experimental thermal mapping data, results, discussion and conclusions can be applied to numerous applications.
Venugopal Vengala, Design Engineer, Cummins, Inc.

Copper Foam Wicks and Their Influence on the Performance of High-Powered, Ultra-Thin Heat Pipes for Thermal Management of Consumer Electronics
Heat pipes are commonly used in consumer electronics thermal modules. They quickly transfer heat through phase change heat transfer, and their performance is mainly driven by the wicking structure, which pumps the working fluid back toward the heat source.

An overview of copper foam wicks’ microstructure parameters will be presented along with their effect on heat transfer capacity. It has been shown that copper foam wicks increase heat pipe power capacity by more than 65 percent compared with standard sintered copper powder wicks. Consequently, copper foam wicks allow for the development of high-powered, thin heat pipes.
Dominic Pilon, Founder and CTO, Metafoam Technologies, Inc.


For program questions, contact Nick Depperschmidt at 800-803-9488 x111.

For sponsor/exhibitor questions, contact Jeremy Fleming at 800-803-9488 x130.

To learn more, visit the Advancements in Thermal Management 2010 Website

Webcom Communications
7355 E. Orchard Road, Suite 100 s
Greenwood Village, CO 80111 USA

Phone 800-803-9488
Fax +1 720-528-3771