CFP: ThermoSense: Thermal Infrared Applications XXXV

Abstract Deadline extended to?? 9 November 2012.

www.ThermoSense.org

In case of multiple submissions, the Program Committee reserves the right to allow only one oral presentation per author group while transferring the others to the poster session. During the Symposium, authors are expected to attend their respective sessions to enable interaction with the audience.

Unless otherwise requested by authors, authors and abstracts will be posted at: www.ThermoSense.org.

Call for Papers 2013:

Thermal / infrared related papers are solicited in the areas listed, and are also welcome in other areas:

Aerospace Applications

??? Aircraft NDT
??? Process Monitoring
??? Corrosion/FOD/fatigue
??? Aging aircraft
??? Spacecraft & satellites

Automotive Industry


??? Predictive maintenance – electrical
??? Predictive maintenance – mechanical
??? Automotive NDT
??? Process monitoring – automation
??? Testing, measurement QA, R&R and validation

Building Applications

??? Energy Conservation and Energy Efficiency
??? Construction quality control
??? Roof moisture surveying
??? Weatherization

Environmental and Agricultural Monitoring

??? Agriculture and water conservation
??? Fish and wildlife migration
??? Geology
??? Pollution and stormwater monitoring
??? Remote detection and environmental sensing

Food Processing

??? Quality control
??? Temperatures of animals at slaughter
??? Foreign object detection and characterization

Infrastructure

??? Electric Power Utilities
??? Natural Gas Utilities
??? Airports and harbors
??? Boats and docks
??? Roads and bridges
??? UXO ??? Unexploded Ordinance

IR Image Fusion Applications

??? Biological and medical
??? Field Security
??? Process Monitoring
??? Structural Analysis

Manufacturing and Processing Industries

??? Composites industry
??? Glass and ceramics
??? Machine vision
??? Metals processing
??? Petroleum and chemical
??? Plastics
??? Predictive maintenance applications
??? Pulp and paper
??? Quality control applications
??? Semiconductors and microelectronics

Materials Evaluation and NDT

??? Fatigue analysis
??? Sonic IR
??? Thermal properties of materials
??? Thermal stress analysis (TSA)

Medical

??? Breast Cancer Screening
??? Veterinary Applications
??? Human and animal application

Miscellaneous

??? Resource and maintenance management
??? Economic impact, justifications studies
??? Equipment, software, and practices guides
??? Professionalism, standards, and certification

NDT (Nondestructive Testing)

??? Composite materials and structures
??? Subsurface flaws
??? Metallic structures
??? Underground anomalies
??? Electronic components

Power Generation and Distribution (Electric)

??? Field measurement issues
??? Power plant heat-rate efficiency
??? Electrical and Mechanical P/PM

Research and Development

??? Enhanced spatial resolution
??? Enhanced time resolution
??? Image interpretation
??? Medical applications
??? Microscopy
??? New methodologies
??? Thermal modeling, CFD and FEA

Security

??? Disease screening
??? Fire and rescue
??? Law enforcement
??? Surveillance in civilian applications

The regular Abstract submission Guidelines are online at http://spie.org/DSSsubmissionguidelines.xml. For?? an extra quick receipt of a post deadline summary Abstract (Placeholder), send one that is not 100 characters long at??? www.spie.org/ds101.

Monday Evening Exhibitor Vendor Session

What’s New in Infrared Imaging Hardware and Software?

(Presentations by equipment and service vendors)
This session is now in its ninth year and has become very popular. This venue provides an early opportunity for exhibitors to showcase their latest technology and products to the ThermoSense and IR community, prior to the opening of the exhibits.

This also enables the technical conference attendees to better prioritize their activities when visiting the exhibits. It is a casual meeting with ample time for questions and answers. Your company must be an exhibitor at DSS13 to be part of this event.

Moderators:
Herbert Kaplan, Honeyhill Technical Company
Andres E. Rozlosnik, SI Termograf??a Infrarroja

If you are interested in participating, or have more questions, please contact: Herbert Kaplan, hkaplan@earthlink.net or Andres Rozlosnik, aer@termografia.com.

ThermoSense XXXV Conference Chairs

Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (USA); Fred P. Colbert, Colbert Infrared Services (USA).

Program Committee

Andrea Acosta, Colbert Infrared Services (USA); Nicolas P. Avdelidis, National Technical Univ. of Athens (Greece); Jeff R. Brown, Hope College (USA); Douglas Burleigh, La Jolla Cove Consulting (USA); K. Elliott Cramer, NASA Langley Research Ctr. (USA); Ralph B. Dinwiddie, Oak Ridge National Lab. (USA); Ermanno G. Grinzato, Consiglio Nazionale delle Ricerche (Italy); Sheng-Jen Hsieh, Texas A&M Univ. (USA); Herbert Kaplan, Honeyhill Technical Co. (USA); Timo T. Kauppinen, VTT Technical Research Ctr. of Finland (Finland); Dennis H. LeMieux, Siemens Power Generation, Inc. (USA); Monica Lopez Saenz, IRCAM GmbH (Germany); Xavier P. V. Maldague, Univ. Laval (Canada); Gary L. Orlove, FLIR Systems, Inc. (USA); G. Raymond Peacock, Temperatures.com, Inc. (USA); Piotr Pregowski, Pregowski Infrared Services (Poland); Ralph A. Rotolante, Vicon Infrared (USA); Andr??s E. Rozlosnik, SI Termograf??a Infrarroja (Argentina); Morteza Safai, The Boeing Co. (USA); Takahide Sakagami, Kobe Univ. (Japan); Steven M. Shepard, Thermal Wave Imaging, Inc. (USA); Sami Siikanen, VTT Technical Research Ctr. of Finland (Finland); Vladimir P. Vavilov, Tomsk Polytechnic Univ. (Russian Federation); Xiong Yu, Case Western Reserve Univ.; Joseph N. Zalameda, NASA Langley Research Ctr. (USA).

Steering Committee Emeritus Members:
Sven-??ke Ljingberg, Univ. of G??yle (Sweden); John R. Snell, Snell Infrared (United States); Robert Madding, FLIR Systems (United States).

About The ThermoSense Conference

The Infrared Applications, ThermoSense conference promotes the worldwide exchange of information about the uses and applications of Infrared (IR) imaging technology. This includes Infrared thermography, thermal infrared sensing, as well as IR imaging and measuring instruments. ThermoSense encompasses technical papers, workshops and short-courses. Over the past thirty-three years these activities have included topics from the fundamentals of infrared imaging and infrared system calibration to virtually all civilian infrared applications. Special emphasis has been placed on problem solving and turning new developments into standard practices.

More online at www.ThermoSense.org.

ThermoSense XXXV?? is one of the 62 Conferences held by SPIE under the name of the DSS Symposium as a part of the program track on IR Sensors and Systems . It will be held in Baltimore MD, USA 29 April – 3 May 2013 at the Baltimore Convention Center
More about location and arrangements at: http://spie.org/x6765.xml?WT.svl=mddce7.