FLIR SPIE DCS Special Presentation: Make Something Big with Something Small

19 April 2016 Time: 10:15 AM | Industry Stage, Exhibition Hall- SPIE DCS 2016

The New FLIR Boson™ –- Powerful System-On-a-Chip

FLIR SYSTEMs Boson
FLIR Systems’ Boson™

WILSONVILLE, OR, USA– – FLIR Systems, Inc. has announced Boson™, its smallest, lightest, and least power-consuming, high-performance uncooled thermal camera for original equipment manufacturers (OEMs).

Sized between FLIR’s Tau(R) and Lepton(R) camera cores, Boson™ is the first thermal camera core to incorporate a sophisticated, low-power multi-core vision processor running FLIR XIR(TM) expandable infrared video processing architecture.

Boson™features a high sensitivity 12-micron pixel pitch detector that provides high-resolution thermal imaging in a small, low power, lightweight, turnkey package.

It also offers several levels of video processing with inputs and processing for other sensors including visible CMOS imaging sensors, Global Positioning Systems (GPSs), and Inertial Measurement Units (IMUs).

Additionally, FLIR XIR provides OEM customers with a suite of advanced image processing features including, super resolution algorithms, sophisticated noise reduction filters, local area contrast enhancement and image blending.

Offered in 320 x 256 and 640 x 512 formats with 15 field-of-view options, Boson™ offers the widest range of features and lens choices for FLIR’s OEM customers.

Boson also supports common interfaces for displays, storage devices and data communication.

OEMs can also leverage FLIR’s Solution Accelerator to develop product solutions for key market verticals including firefighting, automotive, maritime, hunting, UAS, and military.

“Boson represents a significant advancement in size, weight, power and cost for small high-performance microbolometer-based cameras,” said Andy Teich, President and CEO of FLIR.

“As the market demand for affordable and smaller sized camera cores strengthens, we continue to drive technical breakthroughs that enable high performance sensing at lower costs to produce. We’re excited to introduce Boson into our family of cores and to offer a broader range of configuration options to OEMs that will help them expedite development and lower their cost-to-market.”

The FLIR Boson is available to OEMs today for product development testing. FLIR will first showcase Boson at the SPIE Defense and Commercial Sensing Conference this week in Baltimore, Maryland in booth 822.

To learn more about Boson™, please visit www.flir.com/Boson.

See it again at SPIE DCS:

Tuesday 19 April 2016 | Time: 5:15 PM – 5:30 PM
Wednesday 20 April 2016 | Time: 10:45 AM – 11:00 AM
Location: Industry Stage, Exhibition Hall

About FLIR Systems

FLIR Systems, Inc. is a world leader in the design, manufacture, and marketing of sensor systems that enhance perception and awareness. FLIR’s advanced thermal imaging and threat detection systems are used for a wide variety of imaging, thermography, and security applications, including airborne and ground-based surveillance, condition monitoring, research and development, manufacturing process control, search and rescue, drug interdiction, navigation, transportation safety, border and maritime patrol, environmental monitoring, and chemical, biological, radiological, nuclear, and explosives (CBRNE) detection. For more information, go to FLIR’s web site at www.FLIR.com.

Forward-Looking Statements The statements in this release by Andy Teich and the other statements in this release about the products described above are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such statements are based on current expectations, estimates, and projections about FLIR’s business based, in part, on assumptions made by management. These statements are not guarantees of future performance and involve risks and uncertainties that are difficult to predict. Therefore, actual outcomes and results may differ materially from what is expressed or forecasted in such forward-looking statements due to numerous factors, including the following: the ability to manufacture and deliver the systems referenced in this release, changes in pricing of FLIR’s products, changing demand for FLIR’s products, product mix, the impact of competitive products and pricing, constraints on supplies of critical components, excess or shortage of production capacity, the ability of FLIR to manufacture and ship products in a timely manner, FLIR’s continuing compliance with U.S. export control laws and regulations, and other risks discussed from time to time in FLIR’s Securities and Exchange Commission filings and reports. In addition, such statements could be affected by general industry and market conditions and growth rates, and general domestic and international economic conditions. Such forward-looking statements speak only as of the date on which they are made and FLIR does not undertake any obligation to update any forward-looking statement to reflect events or circumstances after the date of this release, or for changes made to this document by wire services or Internet service providers..

WhyBoson™?

  • Thermal Camera Core with Revolutionary Size, Weight & Power (SWaP)
  • Its remarkably low SWaP (starting at just 7.5 grams and 4.9 cm3) and extreme flexibility lets you trade features for power consumption
  • Powerful FLIR XIR Video Processing – An Industry-Leading System-on-a-Chip
  • FLIR’s expandable infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics
  • Premium Brand at Value Price
  • Boson new design lets FLIR bring you high resolution cameras at low resolution prices