Microelectronic Design & Measurement Group Formed

SANTA CLARA CA, USA — /PRNewswire via COMTEX/ — Three companies, Thermal Engineering Associates (TEA), Package Science Services (PSS), and Microsanj, have collaborated to form the Microelectronic Design and Measurement (MD&M) Group.

The MD&M Group will better serve customers of the three companies with a broad range of complementary products and services in the very specialized field of semiconductor and systems thermal management.


TEA_logo102TEA: Founded by Bernie Siegal, a 40+ year veteran and recognized technical leader in the semiconductor thermal field, its mission is to provide a central source for the products and services necessary for proper semiconductor thermal management.

Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field.

For more information on TEA, go to www.thermengr.net

PSS_logoPSS: Founded by Tom Tarter, PSS brings together an extensive array of design, characterization and modeling tools and over 25 years of experience in IC and optical package engineering. Services include thermal modeling, measurement and design, high frequency interconnect measurements, models and analysis, mechanical design, and turnkey fixtures and assemblies.

For more information on PSS, go to www.pkgscience.com

MicrosanjlogoMicrosanj, founded in 2007, is a leading provider of high-resolution transient thermal imaging services and solutions for development and research applications.

Microsanj systems use optical thermoreflectance characterization, digital signal processing and advanced patented software algorithms to support microelectronic hot spot detection and failure analysis.

For more information on Microsanj, go to www.microsanj.com.

MD&M products and services support the design, analysis, and measurement of semiconductors, packages, and systems, with consulting services and products for the design of systems cooling, thermal environments, and associated fixtures; measurement of thermal resistance in a variety of environments; steady state and transient imaging of package and substrate thermal characteristics; characterization of high frequency packages and device interconnects; precise heat sources in the form of thermal test chips and thermal test vehicles, among other products and services.

The three companies have recently moved to 3287 Kifer Road, Santa Clara, CA 95051-0826, where they maintain offices, labs, and research facilities.

SOURCE Thermal Engineering Associates via Market Watch